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Teledyne Awarded $5 Million Space Hardware Contract

Investor Contact:
Jason VanWees
(805) 373-4542
Press Contact:
Robyn E. McGowan
(805) 373-4540

 



LOS ANGELES, California -- April 16, 2007 -- Teledyne Technologies Incorporated today announced that its subsidiary, Teledyne Brown Engineering, Inc., has been awarded a $5 million contract by the Cargo Mission Prime Contractor, Lockheed Martin, to manufacture Flight Releasable Attachment Mechanism (FRAM) carriers that are used to release payloads from the Space Shuttle Cargo Bay.

Under the contract, Teledyne Brown will build a Large Adapter Plate Assembly (LAPA) and multiple EXPRESS Pallet Adapters (ExPAs). The LAPA will be used to transport Large Orbital Replacement Units such as pump modules to the International Space Station (ISS). Because of their design, the LAPA and ExPAs allow robots to pick up and move the carriers without an astronaut leaving the ISS.

The scope of work includes precision machining of aluminum components and final assembly, system engineering and integration, quality assurance as well as safety and mission assurance. All of the hardware will be manufactured at Teledyne Brown's facilities in Huntsville, Alabama.

"This contract is the result of a competitive procurement for hardware that fits well with Teledyne Brown's experience and core capabilities," said Robert Mehrabian, chairman, president and chief executive officer of Teledyne Technologies.

Teledyne Brown is one of two companies in the United States that has manufactured this hardware. Since 1999, the company has built 18 systems that include several versions of this hardware.

Teledyne Technologies is a leading provider of sophisticated electronic components, instruments and communication products, systems engineering solutions, aerospace engines and components and on-site gas and power generation systems. Teledyne Technologies has operations in the United States, the United Kingdom, Mexico and Canada. For more information, visit Teledyne Technologies' website at www.teledyne.com.

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